Ku Ping Enterprise Co., Ltd.

In meeting modern micro-pitch requirements in the industry, Ku Ping R&D Team developed and succeeded in the application of 0.15 mm Pitch. The brilliant technical ability makes it one of the best in the advanced world and Ku Ping is supplying solder paste of all kinds of alloy composition, viscosity and particle size and the products is widely applied in uses in the industry.

Features
Excellent soldering point gloss.
Long term printing stability
Good Thixotrophy, free of soldering bead.
Meeting 40 strict test, it can satisfy any kinds of manufacturing operation.

Specification

No.	15-01A	15-01B	23-01A	23-01B
Alloy  Composition	SN63/37PB	SN63/37PB	SN62/2AG/36PB	SN62/2AG/36PB
Flux content	9.3%	9.3%	9.3%	9.3%
Melting point	183℃	183℃	179℃	179℃
Halogen Content	0.02	0.02	0.02	0.02
Powder particle  diameter	20-45μm	20-38μm	20-45μm	20-38μm
Viscosity Number	170±10Pas	170±10Pas	170±10Pas	170±10Pas
Application	0402 High precision electronic	02010.15mm Micro pitch	0402 high precision good conductibility	Micro pitch 0201 QFP communication appratus